Digital signal processing: a computer-based approach, fourth edition
DAFTAR ISI 1 Signal and signal perocessing 2 Discrete-time signals in the time domain 3 Discrete-time signals in the frequency domain 4 Discrete-time systems 5 Finite-length discrete transform…
A text book of machine design
DAFTAR ISI: 1 Introduction 2 Materials and their properties 3 Manufacturing considerations in design 4 Simple stresses in machine parts 5 Torsional and bending stresses in machine parts 6 Var…
Dampak pencemaran lingkungan, edisi 3
DAFTAR ISI Bab 1 Pendahuluan Bab 2 Daya dukung alam Bab 3 Dampak industri dan teknologi Bab 4 Pencemaran udara Bab 5 Pencemaran air Bab 6 Pencemaran daratan Bab 7 Indikator biologis Bab 8 D…
Marine internal combustion engines
DAFTAR ISI Part 1 Theory of Engine Operation Chapter 1 Engine operating cycles Chapter 2 Theory and calculation of actual engine cycle (grinevetsky mazing method) Chapter 3 Power, economy and b…
Digital computer electronics, 3rd edition
Contents: Part 1 Digital principles Chapter 1 Number systems and codes Chapter 2 Gates Chapter 3 More logic gates Chapter 4 TTL circuits Chapter 5 Boolean algebra and karnaugh maps Chapter 6…
Sejarah kota Cimahi
DAFTAR ISI Bab 1 Masa prasejarah Bab 2 Perkembangan kota militer masa Hindia Belanda Bab 3 Dalam gejolak perubahan Bab 4 Dari kota administratif menjadi kota Bab 5 Dinamka sebuah kota Bab 6 P…
Engineering circuit analysis, 8th edition
Conten:; Chapter 1 Introduction Chapter 2 Basic components and electric circuits Chapter 3 Voltage and current laws Chapter 4 Basic nodal and mesh analysis Chapter 5 Handy circuit analysis tec…
Engineering circuit analysis, 7th edition
ISBN/ISSN: 978-0-07-110669-6
Publish Year: (c) 2007
Konstruksi jalan raya: perancangan perkerasan jalan raya, buku 2
Daftar isi: Bab 1 Pendahuluan Bab 2 Kriteria perancangan perkerasan jalan Bab 3 Elemen struktur perkerasan jalan Bab 4 Metode perancangan perkerasan jalan Bab 5 Rancangan bahan perkerasan jala…
Printed circuit handbook, fifth edition
DAFTAR ISI Part 1 Introduction to Printed Circuits Chapter 1 Electronic packaging and high-density interconnectivity Chapter 2 Semiconductor packaging technology Chapter 3 Advanced packaging C…
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